Industry news

June 20, 2013
 

Apple’s fingerprint sensor encapsulation tech could be headed for future iPhone – Apple Insider


Apple Insider

Apple's fingerprint sensor encapsulation tech could be headed for future iPhone
Apple Insider
Apple's patent application, filed in February and titled "Integrally molded die and bezel structure for fingerprint sensors and the like," describes a unitary encapsulation structure that protects a delicate biometric array, while still allowing for a
Apple Invents a Fingerprint Scanner that could be Discretely Hidden within the Patently Apple

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